| CPC B05C 21/00 (2013.01) [B05B 7/062 (2013.01); B05C 11/10 (2013.01); B05D 1/26 (2013.01); B05B 12/18 (2018.02)] | 5 Claims |

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1. An application device comprising:
a liquid nozzle part that ejects liquid to be applied to an electronic component mounted on a substrate;
an air nozzle part that ejects air toward the substrate to form an air curtain at a periphery of a dropping route of the liquid to be applied, the air nozzle part being concentrically arranged with respect to the liquid nozzle part, and the air nozzle part being different from the liquid nozzle part;
an air pump that supplies the air to the air nozzle part;
a negative pressure pump that executes intake from the air nozzle part;
an ejection controlling unit that ejects the air from the air nozzle part at a timing in synchronization with an ejection timing of the liquid to be applied by the liquid nozzle part; and
a switch valve that is coupled to both the air pump and the negative pressure pump and that switches a communication destination of the air nozzle part between the air pump and the negative pressure pump, wherein
the ejection controlling unit is configured to:
when the liquid to be applied is applied to the liquid nozzle part, switch the switch valve to couple the air nozzle part and the air pump to each other so that the air is ejected from the air nozzle part;
when the liquid nozzle part is dipped in anti-curing agent, switch the switch valve to couple the air nozzle part and the negative pressure pump to each other so that the anti-curing agent is sucked into an inner part of the air nozzle part;
eject the air from a first time point before the ejection timing through a second time point after the ejection timing; and
change a length of (i) a first interval from the first time point until the ejection timing or (ii) a second interval from the ejection timing until the second time point according to an ejection amount of the liquid to be applied from the liquid nozzle part.
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