US 12,269,038 B2
Temperature control on digital microfluidics device
Yan-You Lin, Fremont, CA (US); Jian Gong, Danville, CA (US); and Frank Zhong, Menlo Park, CA (US)
Assigned to MGI Holdings Co., Limited, Shenzhen (CN)
Filed by MGI Holdings Co., Limited, Shenzhen (CN)
Filed on Apr. 12, 2024, as Appl. No. 18/633,852.
Application 18/633,852 is a continuation of application No. 18/302,183, filed on Apr. 18, 2023, granted, now 11,980,885.
Application 18/302,183 is a continuation of application No. 17/004,614, filed on Aug. 27, 2020, granted, now 11,660,602, issued on May 30, 2023.
Claims priority of provisional application 62/893,091, filed on Aug. 28, 2019.
Prior Publication US 2024/0253046 A1, Aug. 1, 2024
Int. Cl. B01L 3/00 (2006.01); A47L 15/42 (2006.01); A61L 27/16 (2006.01); A61L 27/56 (2006.01); B01F 23/00 (2022.01); B01F 23/41 (2022.01); B01F 101/23 (2022.01); B01L 7/00 (2006.01); B01L 9/00 (2006.01); B23Q 17/24 (2006.01); C07K 14/705 (2006.01); C08F 220/56 (2006.01); C08L 33/26 (2006.01); C12M 1/34 (2006.01); C12Q 1/04 (2006.01); C12Q 1/18 (2006.01); C12Q 1/6844 (2018.01); C12Q 1/6851 (2018.01); C12Q 1/686 (2018.01); G01K 1/02 (2021.01); G01N 1/31 (2006.01); G01N 21/17 (2006.01); G01N 21/3577 (2014.01); G01N 21/359 (2014.01); G01N 21/39 (2006.01); G01N 21/45 (2006.01); G01N 21/64 (2006.01); G01N 21/77 (2006.01); G01N 21/78 (2006.01); G01N 27/414 (2006.01); G01N 30/12 (2006.01); G01N 30/68 (2006.01); G01N 30/70 (2006.01); G01N 30/72 (2006.01); G01N 30/88 (2006.01); G01N 33/00 (2006.01); G01N 33/18 (2006.01); G01N 33/50 (2006.01); G01N 33/53 (2006.01); G01N 33/543 (2006.01); G01N 33/68 (2006.01); G01N 33/74 (2006.01); G01N 35/00 (2006.01); G01N 35/04 (2006.01); G01N 35/10 (2006.01); G06T 7/00 (2017.01); G06T 7/90 (2017.01); G16H 20/60 (2018.01); G16H 40/63 (2018.01); H10K 10/46 (2023.01); H10K 85/00 (2023.01); H10K 85/20 (2023.01)
CPC B01L 3/502792 (2013.01) [B01L 7/52 (2013.01); C12Q 1/6851 (2013.01); G01K 1/026 (2013.01); B01L 2200/10 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/1827 (2013.01); B01L 2400/0427 (2013.01); C01B 2203/1614 (2013.01); G01K 2217/00 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A microfluidic device comprising:
(a) a fluidic channel comprising a heating zone portion;
(b) a first heating element and a second heating element, the heating zone portion of the fluidic channel extending between the first and second heating elements such that the first and second heating elements control a temperature in the heating zone portion;
(c) the microfluidic device configured such that the first heating element varies in operation state while the first and second heating elements control the temperature in the heating zone portion, and the second heating element operates at a constant operation state while the first and second heating elements control the temperature in the heating zone portion; and
(d) one or more temperature sensors disposed in the fluidic channel;
wherein the microfluidic device further comprises a first substrate structure having a first substrate surface and a second substrate structure having a second substrate surface and spaced apart from the first substrate surface to form the fluidic channel between the first and second substrate surfaces, wherein the one or more temperature sensors protrude into the fluidic channel from at least one of the first substrate surface and the second substrate surface.