US 12,268,870 B2
Microelectrode, preparation method thereof and neural prosthesis
Qi Zeng, Guangdong (CN); and Tianzhun Wu, Guangdong (CN)
Assigned to SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY, Shenzhen (CN)
Appl. No. 17/251,002
Filed by SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY, Guangdong (CN)
PCT Filed Jul. 9, 2019, PCT No. PCT/CN2019/095263
§ 371(c)(1), (2) Date Dec. 10, 2020,
PCT Pub. No. WO2021/003670, PCT Pub. Date Jan. 14, 2021.
Prior Publication US 2021/0260368 A1, Aug. 26, 2021
Int. Cl. A61N 1/05 (2006.01); A61N 1/36 (2006.01); H01B 1/02 (2006.01)
CPC A61N 1/0551 (2013.01) [A61N 1/05 (2013.01); A61N 1/3605 (2013.01); H01B 1/02 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method for fabricating a microelectrode, comprising:
providing a substrate and depositing a first flexible layer on the substrate;
depositing an electrically conductive layer on the first flexible layer through a mask;
depositing a second flexible layer on the electrically conductive layer such that the second flexible layer partially covers a surface of the electrically conductive layer and partially covers a surface of the first flexible layer;
etching the second flexible layer to form a plurality of grooves in which the electrically conductive layer is partially exposed; and
removing the substrate and depositing platinum dendrite structures in the plurality of grooves such that a bottom of each of the plurality grooves is completely covered by the platinum dendrite structures to obtain the microelectrode;
wherein the plurality of grooves and the platinum dendrite structures are arranged in an array, and
wherein each of the first flexible layer and the second flexible layer comprises polyimide or parylene.