US 12,268,509 B2
Flexible circuit with location and force-sensor coils
Christopher T. Beeckler, Brea, CA (US); Joseph T. Keyes, Sierra Madre, CA (US); and Kevin J. Herrera, West Covina, CA (US)
Assigned to BIOSENSE WEBSTER (ISRAEL) LTD., Yokneam (IL)
Filed by BIOSENSE WEBSTER (ISRAEL) LTD., Yokneam (IL)
Filed on Apr. 17, 2023, as Appl. No. 18/301,829.
Application 18/301,829 is a division of application No. 16/036,710, filed on Jul. 16, 2018, granted, now 11,672,461.
Prior Publication US 2023/0293080 A1, Sep. 21, 2023
Int. Cl. A61B 5/00 (2006.01); A61B 5/0538 (2021.01); A61B 5/06 (2006.01); A61B 5/282 (2021.01); A61B 5/341 (2021.01)
CPC A61B 5/341 (2021.01) [A61B 5/0538 (2013.01); A61B 5/063 (2013.01); A61B 5/282 (2021.01)] 14 Claims
OG exemplary drawing
 
1. A flexible circuit, comprising:
a substrate fabricated via a lithographic process such that the substrate comprises between a first number of layers and a second number of layers, the substrate including a first portion and a second portion;
the first portion comprising a first first-portion segment and a second first-portion segment, the first first-portion segment having a first shape and the second first-portion segment having a second shape that is a mirror image of the first shape; and
the second portion comprising a first second-portion segment and a second second-portion segment, the first second-portion segment having a third shape and the second second-portion segment having a fourth shape that is a mirror image of the third shape,
in which the first first-portion segment, the second first-portion segment, the first second-portion segment, and the second second-portion segment are comprised from the same layers of the substrate.