CPC H10N 30/878 (2023.02) [H10N 30/10516 (2023.02); H10N 30/2047 (2023.02)] | 25 Claims |
1. An acoustic imaging system comprising:
an adhesive layer configured to acoustically couple to a sensing plate;
a first electrode layer bonded to the adhesive layer;
a piezoelectric actuator layer below the first electrode layer;
a second electrode layer below the piezoelectric actuator layer and aligned with the first electrode layer to generate an electric field through the piezoelectric actuator layer;
a metalloid oxide layer encapsulating the second electrode layer against the piezoelectric actuator layer; and
an application-specific integrated circuit formed below and coupled to the metalloid oxide layer, the application-specific integrated circuit conductively coupled to the first electrode layer and the second electrode layer.
|