US 11,950,364 B2
Module and equipment
Mitsutoshi Hasegawa, Kanagawa (JP); Satoru Higuchi, Tokyo (JP); and Noritake Tsuboi, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Nov. 17, 2021, as Appl. No. 17/528,816.
Claims priority of application No. 2020-193346 (JP), filed on Nov. 20, 2020; and application No. 2021-146900 (JP), filed on Sep. 9, 2021.
Prior Publication US 2022/0167504 A1, May 26, 2022
Int. Cl. H05K 1/18 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/14 (2013.01) [H05K 2201/10037 (2013.01); H05K 2201/10098 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A module comprising:
a first wiring board;
a first integrated circuit component mounted on the first wiring board;
a second wiring board overlapping with the first wiring board;
a second integrated circuit component mounted on the second wiring board; and
a connection member disposed between the first wiring board and the second wiring board and configured to electrically connect the first wiring board and the second wiring board,
wherein the second integrated circuit component overlaps with the first wiring board, and
wherein the second integrated circuit component supplies power to the first integrated circuit component via a wiring path of the connection member, the wiring path being disposed within a space between the first wiring board and the second wiring board.