US 11,949,407 B2
Solid state relay
Steve Chapel, Iliff, CO (US); and William Pachoud, Boulder, CO (US)
Assigned to Zonit Structured Solutions, LLC, Boulder, CO (US)
Filed by Zonit Structured Solutions, LLC, Boulder, CO (US)
Filed on Dec. 6, 2022, as Appl. No. 18/062,429.
Application 18/062,429 is a continuation of application No. 16/889,444, filed on Jun. 1, 2020, granted, now 11,522,534.
Application 16/889,444 is a continuation of application No. 15/706,368, filed on Sep. 15, 2017, granted, now 10,673,429, issued on Jun. 2, 2020.
Application 15/706,368 is a continuation of application No. 14/217,179, filed on Mar. 17, 2014, granted, now 9,793,887, issued on Oct. 17, 2017.
Claims priority of provisional application 61/792,576, filed on Mar. 15, 2013.
Prior Publication US 2023/0283274 A1, Sep. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H03K 17/13 (2006.01); H03K 17/687 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01)
CPC H03K 17/133 (2013.01) [H03K 17/687 (2013.01); H05K 1/0204 (2013.01); H05K 3/306 (2013.01); H05K 2201/042 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10363 (2013.01); H05K 2201/2036 (2013.01); Y10T 29/4913 (2015.01)] 11 Claims
OG exemplary drawing
 
1. A relay apparatus, comprising:
a relay, implemented on a printed circuit board, operative for switching power between a first contact associated with a first circuit and a second contact; and
one or more heat sink elements, mounted on said printed circuit board, for dissipating heat generated by said relay in operation, wherein said heat sink elements comprise a “u” shaped jumper formed from heat conducting material.