US 11,949,204 B2
Systems and methods for addressing pumping of thermal interface materials in high-power laser systems
Bryan Lochman, Nashville, TN (US); Matthew Sauter, Cambridge, MA (US); Michael Denninger, Bedford, MA (US); Bien Chann, Merrimack, NH (US); Keita Inoue, Burlington, MA (US); and John Roethle, Cambridge, MA (US)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD, Osaka (JP)
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed on Feb. 15, 2023, as Appl. No. 18/109,998.
Application 18/109,998 is a continuation of application No. 16/597,949, filed on Oct. 10, 2019, granted, now 11,611,189.
Claims priority of provisional application 62/745,622, filed on Oct. 15, 2018.
Prior Publication US 2023/0198216 A1, Jun. 22, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01S 3/04 (2006.01); F28F 21/08 (2006.01); H01S 5/024 (2006.01); H05K 7/20 (2006.01)
CPC H01S 3/0405 (2013.01) [F28F 21/084 (2013.01); H05K 7/2049 (2013.01); H05K 7/20509 (2013.01); H01S 5/024 (2013.01)] 31 Claims
OG exemplary drawing
 
1. A laser device comprising:
a beam emitter;
a laser package comprising (i) a thermally conductive top laser cooler disposed above and in thermal contact with the beam emitter and (ii) a thermally conductive bottom laser cooler disposed below and in thermal contact with the beam emitter;
disposed below the laser package, a thermally conductive cooling plate for conducting heat away from the laser package; and
disposed between the laser package and the cooling plate, an electrically isolating barrier layer for preventing electrical conduction between the laser package and the cooling plate,
wherein (i) the electrically isolating barrier layer comprises a plurality of discrete and spaced-apart areal sections with gaps therebetween, and (ii) at least one of the gaps is devoid of material therewithin.