US 11,949,056 B2
Light emitting diode packaging structure
Chih-Hao Lin, Hsinchu (TW); Jo-Hsiang Chen, Hsinchu (TW); Shih-Lun Lai, Hsinchu (TW); Min-Che Tsai, Hsinchu (TW); and Jian-Chin Liang, Hsinchu (TW)
Assigned to Lextar Electronics Corporation, Hsinchu (TW)
Filed by Lextar Electronics Corporation, Hsinchu (TW)
Filed on Apr. 20, 2023, as Appl. No. 18/303,578.
Application 17/653,462 is a division of application No. 16/944,131, filed on Jul. 30, 2020, granted, now 11,296,269, issued on Apr. 5, 2022.
Application 18/303,578 is a continuation of application No. 17/653,462, filed on Mar. 3, 2022, granted, now 11,670,749.
Prior Publication US 2023/0261165 A1, Aug. 17, 2023
Int. Cl. H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/58 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/0095 (2013.01); H01L 33/58 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A light emitting diode packaging structure, comprising:
a flexible substrate;
a first adhesive layer disposed on the flexible substrate;
a plurality of micro light emitting elements disposed on the first adhesive layer, wherein the plurality of micro light emitting elements has a first surface facing to the first adhesive layer and a second surface opposite to the first surface, and the plurality of micro light emitting elements includes a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element;
a conductive pad disposed on the second surface of the micro light emitting element;
a redistribution layer covering the micro light emitting elements and the conductive pad, wherein the redistribution layer comprises an insulating layer and a circuit layer embedded in the insulating layer, and the circuit layer is electrically connected to the conductive pad; and
an electrode pad disposed on the redistribution layer and electrically connecting to the circuit layer, wherein a thickness of the flexible substrate is less than 100 um.