US 11,948,904 B2
Die and package structure
Wei-Chih Chen, Taipei (TW); Hung-Jui Kuo, Hsinchu (TW); Yu-Hsiang Hu, Hsinchu (TW); and Sih-Hao Liao, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 21, 2022, as Appl. No. 17/699,192.
Application 17/699,192 is a continuation of application No. 16/714,811, filed on Dec. 16, 2019, granted, now 11,282,804.
Application 16/714,811 is a continuation of application No. 15/884,254, filed on Jan. 30, 2018, granted, now 10,510,704, issued on Dec. 17, 2019.
Prior Publication US 2022/0208711 A1, Jun. 30, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/29 (2006.01)
CPC H01L 24/19 (2013.01) [H01L 24/02 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 23/295 (2013.01); H01L 24/13 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0236 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/024 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/2405 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/2518 (2013.01); H01L 2924/0645 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0665 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A die, comprising:
a substrate;
a conductive pad, disposed over the substrate;
a connector, disposed on the conductive pad, wherein the connector comprises a seed layer and a conductive post; and
a protection layer, laterally covering the connector, wherein topmost surfaces of the seed layer and the conductive post and a top surface of the protection layer are level with each other.