US 11,948,893 B2
Electronic component with lid to manage radiation feedback
Zhunming Du, Plano, TX (US); Christopher Sanabria, Richardson, TX (US); Timothy M. Gittemeier, Lucas, TX (US); Terry Hon, Saint Paul, TX (US); Anthony Chiu, Richardson, TX (US); and Tariq Lodhi, Cupertino, CA (US)
Assigned to Qorvo US, Inc., Greensboro, NC (US)
Filed by Qorvo US, Inc., Greensboro, NC (US)
Filed on Dec. 21, 2021, as Appl. No. 17/557,551.
Prior Publication US 2023/0197629 A1, Jun. 22, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 23/047 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/047 (2013.01); H01L 23/66 (2013.01); H01L 2223/6683 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a lid defining a cavity, the lid comprising:
at least one sidewall;
a top wall comprising at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material, the at least one dielectric material comprising epoxy; and
a semiconductor positioned within the cavity of the lid; and
wherein the at least one internal conductive layer extends between an input end of the semiconductor to an output end of the semiconductor.