US 11,948,863 B2
Package structure and method of forming the same
Hung-Chun Cho, Hsinchu (TW); Hung-Jui Kuo, Hsinchu (TW); Yu-Hsiang Hu, Hsinchu (TW); Sih-Hao Liao, New Taipei (TW); and Wei-Chih Chen, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 8, 2023, as Appl. No. 18/165,929.
Application 18/165,929 is a continuation of application No. 17/687,688, filed on Mar. 7, 2022, granted, now 11,594,472.
Application 17/687,688 is a continuation of application No. 16/547,590, filed on Aug. 22, 2019, granted, now 11,270,927, issued on Mar. 8, 2022.
Prior Publication US 2023/0187318 A1, Jun. 15, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/481 (2013.01) [H01L 21/565 (2013.01); H01L 21/76871 (2013.01); H01L 23/3107 (2013.01); H01L 24/09 (2013.01); H01L 24/32 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02379 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a polymer layer;
a redistribution layer over the polymer layer;
a die sandwich between the polymer layer and the redistribution layer; and
an adhesion promoter layer, an oxide layer, a through via, and an encapsulant sandwich between the polymer layer and the redistribution layer, wherein
the encapsulant laterally encapsulates the die;
the through via extends through the encapsulant;
the adhesion promoter layer and the oxide layer are laterally sandwiched between the through via and the encapsulant,
wherein a bottom portion of the encapsulant is longitudinally sandwiched between the adhesion promoter layer and the polymer layer.