CPC H01L 21/67144 (2013.01) [B65G 47/90 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); B41F 16/00 (2013.01); H01L 2933/0066 (2013.01)] | 11 Claims |
1. A transfer process comprising:
picking up a first group of light emitting diodes (LEDs) from a first donor substrate with a micro pick up array comprising a plurality of clusters of transfer heads, wherein adjacent transfer heads within a row of transfer heads within a cluster are separated by an intra-cluster spacing, and adjacent clusters within a row of clusters are separated by an inter-cluster spacing that is greater than the intra-cluster spacing;
positioning the micro pick up array over a first location of a display substrate;
placing a first LED of the first group of LEDs from each cluster onto the display substrate;
positioning the micro pick up array over a second location of the display substrate; and
placing a second LED of the first group of LEDs from each cluster onto the display substrate.
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