US 11,948,815 B2
High density pick and sequential place transfer process and tool
Antoine Manens, Saratoga, CA (US); Dariusz Golda, Portola Valley, CA (US); and Hyeun-Su Kim, Mountain View, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jun. 11, 2021, as Appl. No. 17/345,253.
Claims priority of provisional application 63/051,125, filed on Jul. 13, 2020.
Claims priority of provisional application 63/051,126, filed on Jul. 13, 2020.
Prior Publication US 2022/0013379 A1, Jan. 13, 2022
Int. Cl. H01L 21/67 (2006.01); B65G 47/90 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); B41F 16/00 (2006.01)
CPC H01L 21/67144 (2013.01) [B65G 47/90 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); B41F 16/00 (2013.01); H01L 2933/0066 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A transfer process comprising:
picking up a first group of light emitting diodes (LEDs) from a first donor substrate with a micro pick up array comprising a plurality of clusters of transfer heads, wherein adjacent transfer heads within a row of transfer heads within a cluster are separated by an intra-cluster spacing, and adjacent clusters within a row of clusters are separated by an inter-cluster spacing that is greater than the intra-cluster spacing;
positioning the micro pick up array over a first location of a display substrate;
placing a first LED of the first group of LEDs from each cluster onto the display substrate;
positioning the micro pick up array over a second location of the display substrate; and
placing a second LED of the first group of LEDs from each cluster onto the display substrate.