US 11,948,810 B2
Apparatus for processing substrates or wafers
Li-Chao Yin, Hsinchu (TW); Yuling Chiu, Hsinchu (TW); Yu-Lung Yang, Taichung (TW); and Hung-Bin Lin, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Feb. 27, 2018, as Appl. No. 15/906,689.
Claims priority of provisional application 62/586,580, filed on Nov. 15, 2017.
Prior Publication US 2019/0148177 A1, May 16, 2019
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67017 (2013.01) [H01L 21/67161 (2013.01); H01L 21/67167 (2013.01); H01L 21/6719 (2013.01); H01L 21/67196 (2013.01); H01L 21/67126 (2013.01); H01L 21/67201 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A vacuum apparatus, comprising:
process chambers comprising a first process chamber, a second process chamber, a third process chamber and a fourth process chamber, each of which comprises a gate valve and a vacuum chamber;
a transfer chamber coupled to the process chambers and comprising sidewalls to which the first, second, third and fourth process chambers are attached; and
a load lock chamber connected to the transfer chamber, wherein:
the transfer chamber includes:
one or more vacuum ports, thorough which a gas inside the transfer chamber is exhausted;
vent ports, from which a vent gas is supplied,
the one or more vacuum ports and the vent ports are arranged line-symmetric with respect to a center line of the transfer chamber that passes a geometric center of the transfer chamber and at least one of the sidewalls of the transfer chamber and is perpendicular to the at least one of the sidewalls,
at least one of the one or more vacuum ports is provided in the transfer chamber in front of the load lock chamber,
the at least one of the one or more vacuum ports are located closer to the load lock chamber than all vent ports provided in the transfer chamber,
the vent ports comprise four pairs of vent ports provided in one-to-one correspondence to the first to fourth process chambers and the four pairs of vent ports include a first pair of vent ports that is provided in front of the first process chamber and the first pair of vent ports is a closest pair of vent port to the first process chamber among the vent ports, a second pair of vent ports is provided in front of the second process chamber and the second pair of vent ports is a closest pair of vent port to the second process chamber among the vent ports, a third pair of vent ports is provided in front of the third process chamber and the third pair of vent ports is a closest pair of vent port to the third process chamber among the vent ports, and a fourth pair of vent ports is provided in front of the fourth process chamber and the fourth pair of vent ports is a closest pair of vent ports to the fourth process chamber among the vent ports;
one or more vacuum valves coupled to the one or more vacuum ports, respectively;
vent valves coupled to the vent ports, respectively; and
a controller for controlling at least the one or more vacuum valves and the vent valves, wherein:
the controller includes a processor and a storage storing a program, and the program, when executed by the processor, causes the processor:
to open at least one vacuum valve of the one or more vacuum valves and all of the vent valves such that air streams, which flow from the vent ports to the at least one vacuum port of the one or more vacuum ports corresponding to the at least one open vacuum valve of the one or more vacuum valves, are line-symmetric with respect to a center line of the transfer chamber, while all gate valves of the process chamber are closed.