US 11,948,806 B2
Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device
Paolo Crema, Vimercate (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Dec. 13, 2021, as Appl. No. 17/549,280.
Claims priority of application No. 102020000031226 (IT), filed on Dec. 17, 2020.
Prior Publication US 2022/0199426 A1, Jun. 23, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 21/4842 (2013.01) [H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A method, comprising:
arranging a set of semiconductor dice on a die pad of a metallic leadframe, said set of semiconductor dice including a first semiconductor die and a second semiconductor die, wherein the first semiconductor die and the second semiconductor die each have sets of bonding pads at their front surfaces opposed to the die pad;
forming a layer of laser-activatable material on said first semiconductor die, said second semiconductor die, and a set of electrically-conductive leads of the metallic leadframe arranged around the die pad;
directing laser radiation on said layer of laser-activatable material to pattern a set of laser-activated lines, wherein said set of laser-activated lines include:
i) a first subset of laser-activated lines configured to couple selected bonding pads of one or more of said first semiconductor die and said second semiconductor die to selected electrically-conductive leads in said set of electrically-conductive leads;
ii) a second subset of laser-activated lines configured to couple selected bonding pads of said first semiconductor die to selected bonding pads of said second semiconductor die; and
iii) a third subset of laser-activated lines configured to couple each of said laser-activated lines in said second subset of laser-activated lines to one or more of at least one laser-activated line in said first subset of laser-activated lines, and at least one electrically-conductive lead in said set of electrically-conductive leads;
depositing a first metallic layer on said first, second, and third subsets of laser-activated lines to provide respective first, second, and third subsets of electrically-conductive lines;
selectively depositing a second metallic layer on said first and second subsets of electrically-conductive lines, but not the third subset of electrically-conductive lines, by electroplating to provide respective first and second subsets of electrically-conductive tracks; and
selectively removing said third subset of electrically-conductive lines.