US 11,948,752 B2
Ceramic electronic component and method of manufacturing the same
Sung Hyung Kang, Suwon-si (KR); Jong Hyun Cho, Suwon-si (KR); Ji Hong Jo, Suwon-si (KR); Hang Kyu Cho, Suwon-si (KR); Jae Shik Shim, Suwon-si (KR); Yong In Kim, Suwon-si (KR); and Sang Roc Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 21, 2022, as Appl. No. 18/085,840.
Application 18/085,840 is a continuation of application No. 16/857,280, filed on Apr. 24, 2020, granted, now 11,569,037.
Claims priority of application No. 10-2020-0001979 (KR), filed on Jan. 7, 2020.
Prior Publication US 2023/0129225 A1, Apr. 27, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); C04B 35/468 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/4682 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); C04B 2235/652 (2013.01); C04B 2235/783 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A ceramic electronic component comprising:
a body including first and second internal electrodes overlapping each other with a dielectric layer disposed therebetween,
wherein dielectric grains of the dielectric layer have core-shell structures having a core and a shell surrounding at least a portion of the core and including a rare earth element in a concentration higher than the core,
wherein at least one of the dielectric grains has a core-dual shell structure having a core and a dual shell, the dual shell comprises a first shell surrounding at least a portion of the core and a second shell surrounding at least a portion of the first shell, and
wherein a thickness of the first shell along a straight line connecting α and β is 5 to 30% of a distance between α and β, where α denotes a center of the core-dual shell structure in a cross-section of the core-dual shell structure and β denotes a point on a surface of the second shell.