CPC H01F 27/2804 (2013.01) [H01L 23/645 (2013.01); H01L 28/10 (2013.01); H01F 2019/085 (2013.01); H01F 2027/2809 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a laminate including:
a dielectric layer having a first surface and a second surface opposed to the first surface;
a first conductive layer forming a circuit element overlying the first surface of the dielectric layer; and
a second conductive layer overlying the second surface of the dielectric layer;
a patterned first magnetic layer over the first conductive layer;
a second magnetic layer over the second conductive layer;
wherein a first edge surface of the patterned first magnetic layer is coplanar with a first edge surface of the laminate; and
wherein a second edge surface of the patterned first magnetic layer is coplanar with a second edge surface of the laminate;
wherein a first edge surface of the second magnetic layer is coplanar with the first edge surface of the laminate;
wherein a second edge surface of the second magnetic layer is coplanar with the second edge surface of the laminate;
wherein the circuit element includes a first transformer coil overlying the first surface of the dielectric layer;
wherein the second conductive layer forms a second transformer coil overlying the second surface of the dielectric layer; and
wherein the laminate further includes a third conductive layer forming an electromagnetic interference (EMI) shield between and isolated from the first conductive layer and the second conductive layer.
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