US 11,948,034 B2
Electronic card structure with decoration
Jen-Hsiang Liu, Taoyuan (TW); and Jung-Hsiu Chen, Taoyuan (TW)
Assigned to BEAUTIFUL CARD CORPORATION, Taoyuan (TW)
Filed by BEAUTIFUL CARD CORPORATION, Taoyuan (TW)
Filed on Dec. 14, 2022, as Appl. No. 18/080,755.
Claims priority of application No. 111122494 (TW), filed on Jun. 16, 2022.
Prior Publication US 2023/0409859 A1, Dec. 21, 2023
Int. Cl. G06K 19/06 (2006.01); G06K 19/077 (2006.01)
CPC G06K 19/07705 (2013.01) 4 Claims
OG exemplary drawing
 
1. An electronic card structure with decorations, comprising:
a card body comprising a panel and a bottom plate, the panel being disposed on top of the bottom plate and having a through hole portion;
an electrical control module disposed in the card body and comprising a circuit control carrier plate and a non-contact type radio-frequency antenna or a contact type communication chip, the non-contact type radio-frequency antenna being disposed at the circuit control carrier plate, or the contact type communication chip being disposed at the circuit control carrier plate; and
a decoration module disposed in the card body and comprising a transparent casing and a decoration, the transparent casing being disposed at the panel through the through hole portion, and the decoration being disposed in the transparent casing,
wherein the transparent casing has a receiving portion and a periphery portion, the periphery portion being disposed on a periphery of the receiving portion and confined to a bottom side of the panel, and the receiving portion being disposed at the panel through the through hole portion, and
wherein the circuit control carrier plate is disposed between the panel and the bottom plate, and the decoration module is disposed between the panel and the circuit control carrier plate, with a supporting frame-shaped plate disposed between the panel and the circuit control carrier plate, wherein the supporting frame-shaped plate and the periphery portion are of equal thickness and have an intervening adhesive layer.