US 11,947,266 B2
Method for controlling a manufacturing process and associated apparatuses
Nicolaas Petrus Marcus Brantjes, Eindhoven (NL); Matthijs Cox, Valkenswaard (NL); Boris Menchtchikov, Redwood City, CA (US); Cyrus Emil Tabery, San Jose, CA (US); Youping Zhang, Cupertino, CA (US); Yi Zou, Foster City, CA (US); Chenxi Lin, Newark, CA (US); Yana Cheng, San Jose, CA (US); Simon Philip Spencer Hastings, San Jose, CA (US); and Maxim Philippe Frederic Genin, San Mateo, CA (US)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Appl. No. 17/297,171
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
PCT Filed Nov. 14, 2019, PCT No. PCT/EP2019/081282
§ 371(c)(1), (2) Date May 26, 2021,
PCT Pub. No. WO2020/126242, PCT Pub. Date Jun. 25, 2020.
Claims priority of provisional application 62/802,866, filed on Feb. 8, 2019.
Claims priority of application No. 18214013 (EP), filed on Dec. 19, 2018.
Prior Publication US 2022/0026810 A1, Jan. 27, 2022
Int. Cl. G03F 7/00 (2006.01); G03F 9/00 (2006.01)
CPC G03F 7/70491 (2013.01) [G03F 7/70633 (2013.01); G03F 9/7046 (2013.01)] 20 Claims
 
1. A method for determining a correction relating to a performance metric of a semiconductor manufacturing process, the method comprising:
obtaining a first set of pre-process metrology data;
processing the first set of pre-process metrology data, the processing comprising decomposing the pre-process metrology data into one or more components which:
a) correlate to the performance metric; or
b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and
applying a trained model to the processed first set of pre-process metrology data to determine the correction for the semiconductor manufacturing process.