US 11,947,250 B2
Wavelength conversion element with heat conductive layer and projector
Tsung-Hsiang Fu, Hsin-Chu (TW)
Assigned to Coretronic Corporation, Hsin-Chu (TW)
Filed by Coretronic Corporation, Hsin-Chu (TW)
Filed on Jul. 9, 2021, as Appl. No. 17/371,129.
Claims priority of application No. 202010720584.5 (CN), filed on Jul. 24, 2020.
Prior Publication US 2022/0029072 A1, Jan. 27, 2022
Int. Cl. G03B 21/20 (2006.01); G03B 21/16 (2006.01); H01L 33/50 (2010.01)
CPC G03B 21/204 (2013.01) [G03B 21/16 (2013.01); G03B 21/2066 (2013.01); H01L 33/504 (2013.01); H01L 33/507 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A wavelength conversion element, comprising a substrate, a wavelength conversion layer, a reflective layer, and a heat conductive layer, wherein:
the wavelength conversion layer is disposed on the substrate,
the reflective layer is disposed on the substrate and is located between the substrate and the wavelength conversion layer,
the heat conductive layer is disposed on the substrate, wherein at least a portion of the heat conductive layer is located between the substrate and the reflective layer, and
the substrate comprises a base board and a surface treatment layer, at least a portion of the surface treatment layer is located between the heat conductive layer and the base board, the surface treatment layer has a non-smooth surface and exhibits a reflective property, and the surface treatment layer is a porous material made of an oxidized material of the base board, wherein the non-smooth surface and an inner portion of the surface treatment layer are filled by the heat conductive layer.