US 11,946,523 B2
Wideband vibration suppression device utilizing properties of sonic black hole
Li Cheng, Hong Kong (CN); and Tong Zhou, Hong Kong (CN)
Assigned to THE HONG KONG POLYTECHNIC UNIVERSITY, Hong Kong (CN)
Appl. No. 16/965,851
Filed by THE HONG KONG POLYTECHNIC UNIVERSITY, Hong Kong (CN)
PCT Filed Oct. 17, 2018, PCT No. PCT/CN2018/110628
§ 371(c)(1), (2) Date Jul. 29, 2020,
PCT Pub. No. WO2019/148891, PCT Pub. Date Aug. 8, 2019.
Claims priority of application No. 201810086724.0 (CN), filed on Jan. 30, 2018.
Prior Publication US 2021/0054898 A1, Feb. 25, 2021
Int. Cl. F16F 7/10 (2006.01); G10K 11/168 (2006.01)
CPC F16F 7/10 (2013.01) [G10K 11/168 (2013.01); F16F 2222/08 (2013.01); F16F 2226/04 (2013.01); F16F 2226/042 (2013.01); F16F 2226/048 (2013.01); F16F 2228/007 (2013.01); F16F 2228/04 (2013.01); F16F 2230/18 (2013.01); F16F 2234/00 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A broadband vibration suppression apparatus using an acoustic black hole feature, comprising:
a vibration-reduced body comprising a uniform portion of a fixed thickness and a tapered portion integrally connected with the uniform portion, the tapered portion being extended from a junction in a manner that a thickness of the tapered portion gradually decreases from the fixed thickness of the uniform portion to a predetermined thickness, wherein the uniform portion and the tapered portion being integrally connected at the junction; and
a damping layer attached to the tapered portion of the vibration-reduced body
wherein the apparatus further comprises a connector attached to a bottom of the uniform portion of the vibration-reduced body, so as to connect the vibration-reduced body to a device to be vibration-reduced.