US 11,946,144 B2
Electroless palladium plating solution
Tsuyoshi Maeda, Osaka (JP); Katsuhisa Tanabe, Osaka (JP); and Tomohiro Kawahara, Osaka (JP)
Assigned to C. UYEMURA & CO., LTD., Osaka (JP)
Appl. No. 16/753,395
Filed by C. Uyemura & Co., Ltd., Osaka (JP)
PCT Filed Oct. 3, 2018, PCT No. PCT/JP2018/036971
§ 371(c)(1), (2) Date Apr. 3, 2020,
PCT Pub. No. WO2019/069965, PCT Pub. Date Apr. 11, 2019.
Claims priority of application No. 2017-195652 (JP), filed on Oct. 6, 2017.
Prior Publication US 2020/0318239 A1, Oct. 8, 2020
Int. Cl. C23C 18/44 (2006.01); C09D 5/00 (2006.01); C09D 5/02 (2006.01)
CPC C23C 18/44 (2013.01) [C09D 5/00 (2013.01); C09D 5/024 (2013.01)] 5 Claims
 
1. An electroless Pd plating solution consisting of:
a Palladium compound;
a reducing agent;
a complexing agent;
a compound or metal containing at least one selected from the group consisting of Ge, Ce, Sm, and Y;
water; and
optionally, a sulfur-containing compound as a stabilizer,
wherein a pH of the electroless Pd plating solution is from 4 to 10, and
a total amount of the at least one selected from the group consisting of Ge, Ce, Sm, and Y in the electroless Pd plating solution is 1 g/L to 10 g/L.