	US 11,945,924 B2
	Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same
Songgang Chai, Guangdong (CN); Qianfa Liu, Guangdong (CN); Liangpeng Hao, Guangdong (CN); and Wei Liang, Guangdong (CN)
Assigned to SHENGYI TECHNOLOGY CO., LTD., (CN)
Appl. No. 17/766,440
Filed by SHENGYI TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Dec. 17, 2020, PCT No. PCT/CN2020/137249 § 371(c)(1), (2) Date Apr. 4, 2022, PCT Pub. No. WO2022/120921, PCT Pub. Date Jun. 16, 2022.
Claims priority of application No. 202011448026.4 (CN), filed on Dec. 9, 2020.
Prior Publication US 2023/0192972 A1, Jun. 22, 2023
Int. Cl. C08J 5/18 (2006.01); C08K 7/18 (2006.01); C08K 9/06 (2006.01); C08L 27/18 (2006.01); H05K 1/03 (2006.01)

CPC C08J 5/18 (2013.01) [C08K 7/18 (2013.01); C08K 9/06 (2013.01); C08L 27/18 (2013.01); H05K 1/0373 (2013.01); C08J 2327/18 (2013.01); C08J 2427/18 (2013.01); C08J 2471/02 (2013.01); C08K 2201/005 (2013.01); C08L 2201/52 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); H05K 2201/0209 (2013.01)]

14 Claims

1. A copper clad laminate comprising at least one fluorine-containing dielectric sheet and metal foil(s) covered on one or both sides of the laminated fluorine-containing dielectric sheet, wherein the copper clad laminate has a Dk (10 GHz) of 3.15 or less; a Df (10 GHz) is 0.0010 or less; and a breakdown voltage is 50 kV or more;

wherein the fluorine-containing dielectric sheet comprising a fluorine-containing resin composition;

the fluorine-containing resin composition, comprising 30 wt. %-70 wt. % of a fluorine-containing polymer, and 30 wt. %-70 wt. % of an inorganic filler, wherein the inorganic filler includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm;

wherein the inorganic filler further includes the following particle size distribution: D90 is less than 30 μm; and D100 is less than 50 μm; and

wherein the inorganic filler has a specific surface area less than or equal to 3.0 m²/g.