US 11,945,913 B2
Thermosetting polyimide resin and manufacturing method thereof, composition, prepolymer, film, adhesive, and use thereof
Pi-Tao Kuo, Taipei (TW)
Assigned to CHIN YEE CHEMICAL INDUSTRIES CO., LTD., Taipei (TW)
Filed by CHIN YEE CHEMICAL INDUSTRIES CO., LTD., Taipei (TW)
Filed on Jul. 9, 2020, as Appl. No. 16/924,228.
Claims priority of application No. 109115513 (TW), filed on May 11, 2020.
Prior Publication US 2021/0261733 A1, Aug. 26, 2021
Int. Cl. C08G 73/10 (2006.01); C08G 73/12 (2006.01); C08J 5/18 (2006.01); C09J 179/08 (2006.01)
CPC C08G 73/1082 (2013.01) [C08G 73/1014 (2013.01); C08G 73/1039 (2013.01); C08G 73/1053 (2013.01); C08G 73/124 (2013.01); C08J 5/18 (2013.01); C09J 179/08 (2013.01); C08J 2379/08 (2013.01)] 9 Claims
 
1. A thermosetting polyimide resin, with a chemical structure thereof shown in Formula (1):

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where P is a C36 divalent hydrocarbon group having an aliphatic side chain;
X and Y are

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R1 and R2 are F or CH3;
R3 is

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 or

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 and
n is an integer from 1 to 5000.