US 11,945,073 B2
Dual membrane carrier head for chemical mechanical polishing
Steven M. Zuniga, Soquel, CA (US); Jay Gurusamy, Santa Clara, CA (US); and Andrew J. Nagengast, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 11, 2019, as Appl. No. 16/711,369.
Claims priority of provisional application 62/890,570, filed on Aug. 22, 2019.
Prior Publication US 2021/0053183 A1, Feb. 25, 2021
Int. Cl. B24B 37/32 (2012.01); B24B 37/005 (2012.01)
CPC B24B 37/32 (2013.01) [B24B 37/005 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A carrier head for chemical mechanical polishing, comprising: a base assembly; and a membrane assembly connected to the base assembly, the membrane assembly including a membrane support, an inner membrane secured to the membrane support, wherein the inner membrane forms a plurality of individually pressurizable inner chambers between an upper surface of the inner membrane and the membrane support, wherein each chamber of the plurality of individually pressurizable inner chambers is provided by a floor portion and two side wall portions of the inner membrane, and wherein the plurality of individually pressurizable inner chambers include pairs of adjacently positioned chambers with each pair of adjacently positioned chambers defining a gap therebetween, the gap open to a lower chamber, and an outer membrane secured to the membrane support and extending below the inner membrane, the outer membrane having an inner surface and an outer surface, wherein the outer membrane defines the lower chamber between the inner surface of the outer membrane and a lower surface of the inner membrane, wherein the inner surface is positioned for contact by the lower surface of the inner membrane upon pressurization of one or more of the plurality of individually pressurizable inner chambers, and wherein the outer surface is configured to contact a substrate.