US 11,945,004 B2
System and method of cleaning and inspecting semiconductor die carrier
Hua Hong Tan, Singapore (SG); Wing Keung Lam, Dongguan (CN); Zong Xiang Cai, Dongguan (CN); Wei Ming Xian, Dongguan (CN); Yao Hong Wu, Dongguan (CN); and Tao Hu, Dongguan (CN)
Assigned to UTAC Headquarters Pte. Ltd., Singapore (SG)
Filed by UTAC Headquarters Pte. Ltd., Singapore (SG)
Filed on Nov. 11, 2021, as Appl. No. 17/454,514.
Claims priority of provisional application 63/260,358, filed on Aug. 18, 2021.
Prior Publication US 2023/0058682 A1, Feb. 23, 2023
Int. Cl. B08B 1/00 (2006.01); B08B 1/02 (2006.01); B08B 5/04 (2006.01)
CPC B08B 1/002 (2013.01) [B08B 1/02 (2013.01); B08B 5/04 (2013.01); B08B 5/043 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of cleaning a semiconductor manufacturing equipment, comprising:
providing a carrier;
passing a first rotating brush over a first surface of the carrier;
passing a second rotating brush over a second surface of the carrier opposite the first surface of the carrier;
disposing a first separator in an exhaust path of the first rotating brush to draw away debris dislodged from the first surface of the carrier by the first rotating brush; and
providing a first vacuum suction through the first separator to remove debris dislodged from the first surface of the carrier by the first rotating brush.