US D1,068,869 S
Mold
Danwei Ye, Solon, OH (US); and Andrianna Niebling, Tempe, AZ (US)
Assigned to Hologram Holdings I, Inc., San Clemente, CA (US)
Filed by Spectrum Diversified Designs, LLC, Glenwillow, OH (US)
Filed on Dec. 22, 2023, as Appl. No. 29/922,552.
Term of patent 15 Years
LOC (15) Cl. 15 - 07
U.S. Cl. D15—90
OG exemplary drawing
 
The ornamental design for a mold, as shown and described.