US D1,068,255 S
Cover for earphone case
Bum Joon Lee, Seoul (KR); and Kwang Min Yuk, Seoul (KR)
Assigned to Hamee Global Inc., Seoul (KR)
Filed by Hamee Global Inc., Seoul (KR)
Filed on Nov. 10, 2023, as Appl. No. 35/519,854.
Claims priority of application No. 30-2023-0039732 (KR), filed on Oct. 11, 2023.
Int. Filing Date Nov. 10, 2023
Int. Reg. No. DM/234687
Int. Reg. Date Nov. 10, 2023
Int. Reg. Pub. Date Feb. 2, 2024
Term of patent 15 Years
LOC (15) Cl.
03 -
01
U.S. Cl.
D 3—218
The ornamental design for a cover for earphone case as shown and described.