	US 12,268,079 B2
	Display substrate and manufacturing method thereof, and display device
Li Liu, Beijing (CN); Junbo Wei, Beijing (CN); Pengcheng Lu, Beijing (CN); Shengji Yang, Beijing (CN); Kuanta Huang, Beijing (CN); Rongrong Shi, Beijing (CN); Yuanlan Tian, Beijing (CN); and Dacheng Zhang, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/779,784
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Feb. 3, 2021, PCT No. PCT/CN2021/075134 § 371(c)(1), (2) Date May 25, 2022, PCT Pub. No. WO2021/155813, PCT Pub. Date Aug. 12, 2021.
Claims priority of application No. 202010080873.3 (CN), filed on Feb. 5, 2020.
Prior Publication US 2023/0345803 A1, Oct. 26, 2023
Int. Cl. H10K 59/80 (2023.01); H10K 59/12 (2023.01); H10K 59/123 (2023.01); H10K 59/124 (2023.01); H10K 59/131 (2023.01); H10K 102/00 (2023.01); H10K 102/10 (2023.01)

CPC H10K 59/80518 (2023.02) [H10K 59/1201 (2023.02); H10K 59/123 (2023.02); H10K 59/124 (2023.02); H10K 59/131 (2023.02); H10K 2102/103 (2023.02); H10K 2102/351 (2023.02)]

12 Claims

1. A display substrate, comprising:

a wafer base, provided with a transistor;

a metal reflective structure on the wafer base, wherein the metal reflective structure is electrically connected to the transistor, and is provided with a protrusion protruding away from the wafer base;

a first insulation layer on a side of the metal reflective structure facing away from the wafer base, wherein a surface of a portion, corresponding to the metal reflective structure and facing away from the metal reflective structure, of the first insulation layer is flush with a top face of the protrusion, so as to enable the top face of the protrusion to be exposed, and the top face of the protrusion is a surface of the protrusion facing away from the first insulation layer; and

a transparent anode on a side of the first insulation layer facing away from the metal reflective structure, wherein the transparent anode is in contact connection with the top face of the protrusion.