US 12,268,020 B2
Source or drain template for reducing strain loss in spaced-apart nanosheet channels
Shogo Mochizuki, Mechanicville, NY (US); and Nicolas Loubet, Guilderland, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Sep. 24, 2021, as Appl. No. 17/484,009.
Prior Publication US 2023/0100665 A1, Mar. 30, 2023
Int. Cl. H10D 30/69 (2025.01); H10D 30/01 (2025.01); H10D 30/67 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/85 (2025.01)
CPC H10D 30/797 (2025.01) [H10D 30/031 (2025.01); H10D 30/6757 (2025.01); H10D 84/017 (2025.01); H10D 84/0184 (2025.01); H10D 84/038 (2025.01); H10D 84/85 (2025.01); H10D 30/6735 (2025.01)] 25 Claims
OG exemplary drawing
 
7. A semiconductor-based structure comprising:
a high-k metal gate (HKMG) structure comprising an upper HKMG structure and spaced-apart HKMG structures;
a stack comprising spaced-apart non-sacrificial nanosheets and the spaced-part HKMG structures;
wherein the stack further comprises a stack sidewall comprising sidewalls of end regions of the spaced-apart non-sacrificial nanosheets and sidewalls of end regions of the spaced-apart HKMG structures;
a S/D region adjacent to the stack;
a protective liner on a gate spacer and on a top surface of the S/D region; and
a uniform thickness S/D template layer comprising a first sidewall region, a bottom region, and a second sidewall region;
wherein a lateral width dimension of the upper HKMG structure is less than a lateral width dimension of at least one of the spaced-apart HKMG structures;
wherein a lateral thickness of the first sidewall region, a vertical thickness of the bottom region, and a lateral thickness of the second sidewall region are substantially equal; and
wherein the first sidewall region is between and physically separates the spaced-apart non-sacrificial nanosheets from the S/D region.