US 12,268,001 B2
Nonvolatile memory device
Jung-Hwan Lee, Seoul (KR); and Hyun Min Cho, Incheon (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 4, 2022, as Appl. No. 17/736,384.
Claims priority of application No. 10-2021-0087878 (KR), filed on Jul. 5, 2021.
Prior Publication US 2023/0005954 A1, Jan. 5, 2023
Int. Cl. H10B 43/27 (2023.01); H10B 43/10 (2023.01); H10B 43/30 (2023.01)
CPC H10B 43/27 (2023.02) [H10B 43/10 (2023.02); H10B 43/30 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A nonvolatile memory device comprising:
a substrate;
a mold structure including a plurality of word lines stacked on the substrate;
a first word line cut region cutting the mold structure;
a first channel structure apart from the first word line cut region by a first distance, and in the mold structure and the substrate; and
a second channel structure apart from the first word line cut region by a second distance, and in the mold structure and the substrate,
wherein the second distance is greater than the first distance,
a first width of the first channel structure is different from a second width of the second channel structure, and
a first length of the first channel structure is different from a second length of the second channel structure.