US 12,267,987 B2
Self-cooling chassis for a communications device
Gerard MacManus, Tewsbury, MA (US)
Assigned to RAKUTEN SYMPHONY, INC., Tokyo (JP)
Appl. No. 17/782,056
Filed by Rakuten Symphony, Inc., Tokyo (JP)
PCT Filed May 27, 2022, PCT No. PCT/US2022/031344
§ 371(c)(1), (2) Date Jun. 2, 2022,
PCT Pub. No. WO2023/229606, PCT Pub. Date Nov. 30, 2023.
Prior Publication US 2024/0164061 A1, May 16, 2024
Int. Cl. H05K 7/20 (2006.01); F16M 13/02 (2006.01); H04W 88/08 (2009.01)
CPC H05K 7/20409 (2013.01) [F16M 13/02 (2013.01); H05K 7/2029 (2013.01); H04W 88/085 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a top housing including a first set of input/output (I/O) connectors arranged along a top housing front side, the top housing comprising at least one processor communicatively coupled to the first set of I/O connectors, the top housing having a top side including a plurality of heat fins configured to dissipate heat away from the at least one processor, and the top housing having a top housing aperture;
a bottom housing including a second set of I/O connectors arranged along a bottom housing front side, the bottom housing comprising a I/O circuitry, the I/O circuitry being configured to communicatively couple the second set of I/O connectors to the at least one processor and the bottom housing having a bottom housing aperture; and
a guide pin configured to be inserted into a top housing aperture and a bottom housing aperture;
wherein the top housing and the bottom housing are configured to connect by aligning the top housing front side with the bottom housing front side and by aligning the guide pin into the top housing aperture and the bottom housing aperture.