US 12,267,986 B2
Cooling device
Jiang-Jun Wu, Shanghai (CN); Yi-Dong Ji, Shanghai (CN); and Cheng Han, Shanghai (CN)
Assigned to INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai (CN); and INVENTEC CORPORATION, Taipei (TW)
Filed by INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai (CN); and INVENTEC CORPORATION, Taipei (TW)
Filed on Mar. 20, 2023, as Appl. No. 18/123,388.
Claims priority of application No. 202211058080.7 (CN), filed on Aug. 31, 2022.
Prior Publication US 2024/0074097 A1, Feb. 29, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/473 (2006.01)
CPC H05K 7/20254 (2013.01) [G06F 1/20 (2013.01); H01L 23/473 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A cooling device, comprising:
a cooling plate, a lower flow channel being provided in the cooling plate, a top of the cooling plate being provided with a water outlet and two openings in communication with the lower flow channel, the water outlet being located between the two openings, the water outlet being configured to connect a water outlet nozzle, a bottom of the cooling plate being configured to be in contact with a heat source; and
a mounting cover sealed on the top of the cooling plate, the mounting cover having a C-shaped cross section, the mounting cover comprising a first mounting cover and two second mounting covers provided at both ends of the first mounting cover along a first direction, the first mounting cover and the cooling plate forming an intermediate flow channel, each second mounting cover and the cooling plate forming a branch flow channel, the intermediate flow channel being in communication with the two branch flow channels, the first mounting cover being provided with a water inlet configured to connect a water inlet nozzle, and the two branch flow channels being in communication with the lower flow channel through the two openings, respectively.