US 12,267,984 B2
Heat dissipation assembly
Yi-Han Wang, Taoyuan (TW); Chao-Fu Yang, Taoyuan (TW); Chih-Chung Chen, Taoyuan (TW); Kuo-Tung Hsu, Taoyuan (TW); and Meng-Yu Chen, Taoyuan (TW)
Assigned to Delta Electronics, Inc., Taoyuan (TW)
Filed by Delta Electronics, Inc., Taoyuan (TW)
Filed on Nov. 18, 2022, as Appl. No. 17/990,373.
Claims priority of provisional application 63/284,238, filed on Nov. 30, 2021.
Prior Publication US 2023/0171917 A1, Jun. 1, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20154 (2013.01) [H05K 7/2039 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heat dissipation assembly, comprising:
a bottom plate having a front end and a rear end opposite to each other;
a plurality of fins disposed on the bottom plate, spaced apart from each other and extended in a direction from the front end to the rear end;
a frame disposed on the bottom, covering the plurality of fins and assembled with the bottom plate to form a heat conduction channel and an airflow intake, wherein the airflow intake is disposed adjacent to the front end, the heat conduction channel passes through the plurality of fins, and the frame comprises a first plane, a second plane and an inclined plane, wherein the first plane is disposed adjacent to the front end and spatially corresponding to the plurality of fins, the second plane is disposed adjacent to the rear end and comprises an inlet, the heat conduction channel is in communication between the airflow intake and the inlet, and the inclined plane is connected between the first plane and the second plane, wherein a cross-section area of the heat conduction channel adjacent to the airflow intake is greater than that of the heat conduction channel adjacent to the inlet; and
a fan comprising a top cover and an impeller, wherein the impeller is disposed on the top cover, the top cover is spatially corresponding to the inlet, and assembled with the frame to form an outlet, and the airflow intake and the heat conduction channel are in communication with the outlet through the inlet.