US 12,267,964 B2
Electronic component module and method for manufacturing electronic component module
Toru Komatsu, Nagaokakyo (JP); and Tadashi Nomura, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto-fu (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Mar. 16, 2023, as Appl. No. 18/184,728.
Application 18/184,728 is a continuation of application No. PCT/JP2021/034923, filed on Sep. 24, 2021.
Claims priority of application No. 2020-160701 (JP), filed on Sep. 25, 2020.
Prior Publication US 2023/0217599 A1, Jul. 6, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01)
CPC H05K 3/305 (2013.01) [H05K 1/181 (2013.01); H05K 3/0052 (2013.01); H05K 3/3478 (2013.01); H05K 2201/10007 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/0264 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electronic component module comprising: a plurality of components having terminals and arranged along a plane; a sealing resin portion covering and sealing the plurality of components and having the plane as one plane of an outer surface; and a shield layer covering the outer surface of the sealing resin portion, wherein the plurality of components include a chip component, the chip component includes at least one terminal of the terminals at at least one end portion of a main body having a rectangular parallelepiped shape, at least a part of the at least one end portion including the at least one terminal protrudes from the sealing resin portion, and at least a part of the at least one terminal at the end portion protruding from the plane of the sealing resin portion is provided as a mounting terminal of the electronic component module, wherein the terminals are provided on five surfaces of the end portion protruding from the sealing resin portion of the chip component.