US 12,267,962 B2
Capacitor-wire-embedded wiring board
Soojae Park, Anyang-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Nov. 7, 2022, as Appl. No. 17/981,847.
Claims priority of application No. 10-2022-0033342 (KR), filed on Mar. 17, 2022.
Prior Publication US 2023/0319998 A1, Oct. 5, 2023
Int. Cl. H05K 1/16 (2006.01); H01G 4/01 (2006.01); H01G 4/012 (2006.01); H01G 4/28 (2006.01); H01G 4/38 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01L 23/31 (2006.01)
CPC H05K 1/186 (2013.01) [H01G 4/01 (2013.01); H01G 4/012 (2013.01); H01G 4/28 (2013.01); H01G 4/38 (2013.01); H01L 24/16 (2013.01); H01L 25/16 (2013.01); H05K 1/119 (2013.01); H05K 1/162 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H01G 4/008 (2013.01); H01G 4/1209 (2013.01); H01L 23/3128 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10583 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wiring board, comprising:
an insulating layer having a first surface and a second surface, which are opposite to each other;
upper wiring patterns on the first surface of the insulating layer;
lower wiring patterns on the second surface of the insulating layer;
intermediate wiring patterns, which are disposed in the insulating layer and are electrically connected to the upper wiring patterns and the lower wiring patterns; and
a capacitor wire connected to corresponding wiring patterns of the upper wiring patterns, the lower wiring patterns, and the intermediate wiring patterns,
wherein the capacitor wire comprises:
a core electrode line having a wire shape;
an outer electrode line covering at least a portion of the core electrode line; and
a dielectric line interposed between the core electrode line and the outer electrode line,
wherein the outer electrode line comprises a material whose melting point is lower than a melting point of the core electrode line.