US 12,267,961 B2
Embedded component package structure and manufacturing method thereof
Chien-Fan Chen, Kaohsiung (TW); and Chien-Hao Wang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jan. 23, 2024, as Appl. No. 18/420,528.
Application 18/420,528 is a continuation of application No. 18/095,511, filed on Jan. 10, 2023, granted, now 11,882,660.
Application 18/095,511 is a continuation of application No. 17/342,363, filed on Jun. 8, 2021, granted, now 11,553,596.
Application 17/342,363 is a continuation of application No. 16/942,609, filed on Jul. 29, 2020, granted, now 11,032,911.
Application 16/942,609 is a continuation of application No. 16/159,264, filed on Oct. 12, 2018, granted, now 10,757,813.
Prior Publication US 2024/0164021 A1, May 16, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01)
CPC H05K 1/183 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/568 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/11 (2013.01); H01L 2924/15153 (2013.01); H05K 2201/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A component package structure, comprising:
a component having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface; and
an encapsulation layer covering the lateral surface of the component and having a third surface, wherein the third surface defines a recessed portion.