| CPC H05K 1/181 (2013.01) [H05K 1/115 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10484 (2013.01); H05K 2201/10628 (2013.01)] | 5 Claims |
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1. An electronic component sub-mount adapted to support an electronic component, the electronic component sub-mount comprising:
a body having a top surface, a bottom surface, and a supporting surface, wherein the top surface and the bottom surface are located on opposite sides of the body, the supporting surface is located on one side of the body between the top surface and the bottom surface, and an angle that is not equal to 0 degrees is substantially formed between the supporting surface and the bottom surface, wherein the angle is equal to or less than 90 degrees;
a first conductive layer disposed on the bottom surface, wherein the first conductive layer includes a plurality of first conductive lines; and
a second conductive layer disposed on the supporting surface and extending to the top surface, wherein the second conductive layer includes a plurality of second conductive lines, wherein the second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout that is different from the first pin layout, wherein the second pin layout matches a pin layout of the first conductive lines on the bottom surface,
wherein the body further includes a first lateral surface disposed between the supporting surface and the bottom surface, and
wherein a top edge of the supporting surface is in contact with the top surface, and a bottom edge of the supporting surface is in contact with the first lateral surface, wherein the top edge of the supporting surface is higher than the bottom edge of the supporting surface.
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