US 12,267,957 B2
Hybrid pitch through hole connector
Xiang Li, Portland, OR (US); George Vergis, Portland, OR (US); and Jeffrey Krieger, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 18, 2020, as Appl. No. 17/127,829.
Prior Publication US 2021/0153351 A1, May 20, 2021
Int. Cl. H05K 1/11 (2006.01); G11C 5/06 (2006.01); H01R 12/52 (2011.01); H01R 12/72 (2011.01)
CPC H05K 1/115 (2013.01) [G11C 5/06 (2013.01); H01R 12/523 (2013.01); H01R 12/72 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A connector to couple a card or module to a motherboard, the connector comprising:
a connector housing; and
a plurality of pins including alternating signal and ground pins, signal pins included in a first row in the connector housing, ground pins included in a second row in the connector housing, each of the plurality of pins to include a card or module-facing end to couple with the card or module and a lead to couple with a through hole in the motherboard;
a first pitch between leads of a pin and a first adjacent pin is different than a second pitch between leads of the pin and a second adjacent pin, wherein leads of a signal pin and a first adjacent ground pin have the first pitch and leads of the signal pin and a second adjacent ground pin have the second pitch, and wherein the first and second adjacent ground pins are included in a same row in the connector housing.