US 12,267,956 B2
Mounting structure of electronic component
Noboru Serita, Nagaokakyo (JP); and Yoshiyuki Abe, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 29, 2022, as Appl. No. 17/955,795.
Claims priority of application No. 2021-162785 (JP), filed on Oct. 1, 2021.
Prior Publication US 2023/0104369 A1, Apr. 6, 2023
Int. Cl. H05K 1/00 (2006.01); H01G 4/008 (2006.01); H01G 4/30 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/111 (2013.01) [H01G 4/0085 (2013.01); H01G 4/30 (2013.01); H05K 1/181 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/2081 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A mounting structure of an electronic component comprising:
the electronic component including:
a pair of lands on a board and spaced apart from each other;
solder on each of the lands; and
a component main body including a pair of external electrodes on both end portions of the component main body in a length direction, each of the pair of external electrodes being connected to a corresponding one of the pair of lands via the solder; wherein
where a separation direction of the pair of lands is defined as an X direction and a direction orthogonal or substantially orthogonal to the X direction is defined as a Y direction, when a width dimension of the land along the Y direction is defined as c, a dimension of each of the external electrodes in the X direction is defined as e, and a gap between the land and the external electrode is defined as Gap, 3.4<(c×e)/Gap<258.8 is satisfied.