| CPC H05K 1/0298 (2013.01) [H05K 1/115 (2013.01)] | 5 Claims |
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1. A wiring board comprising:
an insulating layer that is formed by using insulating resin; and
a wiring layer that is formed on a surface of the insulating layer, wherein
the wiring layer includes
a first area in which a wire is formed; and
a second area that includes a pad to which the wire formed in the first area is connected, the pad having a larger size along a width direction of the wire than the wire, and the second area having a smaller wire width than the first area,
the insulating layer includes a conductor portion that is formed by using a conductor in only a range that overlaps with the second area in plan view, and that is sandwiched between the insulating resin,
the pad comprises a plurality of pads,
a wire formed in the second area is positioned in a position sandwiched between the plurality of pads and overlaps with the conductor portion in plan view, and
the conductor portion includes through holes at positions overlapping with the plurality of pads.
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