CPC H05K 1/0204 (2013.01) [F21S 41/141 (2018.01); F21S 45/47 (2018.01); F21Y 2115/10 (2016.08); H05K 2201/066 (2013.01); H05K 2201/09036 (2013.01)] | 14 Claims |
1. A support assembly for an electronic component, the support assembly comprising:
a metallic heat sink; and
a plastic element with a receiving section to accommodate the electronic component, the plastic element being connected to the heat sink in a form-fit manner, the receiving section of the plastic element covering a heat input side of the heat sink, and the plastic element comprising a thermosetting plastic with fillers to increase a thermal conductivity,
wherein the thermosetting plastic with fillers is injection molded or hot pressed directly on the heat sink, such that the receiving section of the plastic element accommodates the electronic component without a circuit board.
|