US 12,267,920 B2
Heater assembly
Tony Reevell, London (GB); and Yingxu Zhang, Dongguan (CN)
Assigned to JT International S.A., (CH)
Appl. No. 17/640,121
Filed by JT International S.A., Geneva (CH)
PCT Filed Aug. 28, 2020, PCT No. PCT/EP2020/074151
§ 371(c)(1), (2) Date Mar. 3, 2022,
PCT Pub. No. WO2021/043693, PCT Pub. Date Mar. 11, 2021.
Claims priority of application No. PCT/CN2019/104804 (WO), filed on Sep. 6, 2019.
Prior Publication US 2022/0304116 A1, Sep. 22, 2022
Int. Cl. B32B 41/00 (2006.01); A24F 40/46 (2020.01); A24F 40/51 (2020.01); A24F 40/70 (2020.01); B29C 61/02 (2006.01); H05B 3/36 (2006.01); B29K 627/18 (2006.01); B29K 671/00 (2006.01); B29K 679/00 (2006.01); B29L 31/00 (2006.01)
CPC H05B 3/36 (2013.01) [A24F 40/46 (2020.01); A24F 40/51 (2020.01); A24F 40/70 (2020.01); B29C 61/02 (2013.01); B29K 2627/18 (2013.01); B29K 2671/00 (2013.01); B29K 2679/08 (2013.01); B29L 2031/7414 (2013.01); H05B 2203/003 (2013.01); H05B 2203/013 (2013.01); H05B 2203/016 (2013.01); H05B 2203/017 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of fabricating a heater assembly comprising:
providing a heating element supported on a surface of a flexible dielectric backing film;
attaching a layer of heat shrink film onto the surface of the flexible dielectric backing film so as to at least partially enclose the heating element between the heat shrink film and the flexible dielectric backing film; and
attaching the heating element to a heating chamber with the layer of heat shrink film.