US 12,267,650 B2
MEMS microphone
Linlin Wang, Shenzhen (CN); Rui Zhang, Shenzhen (CN); Kaijie Wang, Shenzhen (CN); Zhuanzhuan Zhao, Shenzhen (CN); and Minh Ngoc Nguyen, Bac Ninh (VN)
Assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed by AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed on Dec. 29, 2022, as Appl. No. 18/091,346.
Application 18/091,346 is a continuation of application No. PCT/CN2022/125144, filed on Oct. 13, 2022.
Claims priority of application No. 202222343985.0 (CN), filed on Sep. 2, 2022.
Prior Publication US 2024/0080632 A1, Mar. 7, 2024
Int. Cl. H04R 19/04 (2006.01); H04R 7/14 (2006.01)
CPC H04R 19/04 (2013.01) [H04R 7/14 (2013.01); H04R 2201/003 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A MEMS microphone, comprising:
a substrate with a back cavity, and
a capacitive system located on the substrate, comprising a back plate and a diaphragm opposite to the back plate, wherein
the back plate comprises a body portion, a fixing portion connected with the body portion and the substrate, and a plurality of strip reinforcing ribs, the reinforcing ribs are protruded from the body portion, each of the reinforcing ribs is connected with two edges of the body portion, the two edges are opposite to each other.