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1. A microphone chip, comprising: a substrate having a front cavity; and a capacitive system disposed on the substrate and connected to the substrate, wherein the capacitive system comprises a diaphragm disposed on an upper surface of the substrate and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate, wherein the microphone chip further comprises a fixing portion, and the diaphragm and the back plate are respectively connected with the substrate through the fixing portion; the diaphragm comprises an inner membrane portion, an outer membrane portion, and at least one supporting portion, the inner membrane portion is separated from the outer membrane portion by a slit, and the at least one supporting portion is connected with the fixing portion; and the microphone chip further comprises a sealing element, the sealing element is connected with the back plate and disposed between the back plate and the diaphragm, and the sealing element is disposed close to an outer periphery of the inner membrane portion; the microphone chip further comprises an electrode sheet, the electrode sheet comprises an electrode body and at least one lead-out portion; a projection of the electrode body along the vibration direction is located within the sealing element; when the microphone is not operated, the diaphragm is separated from the sealing element; when the microphone is in the operating state, the inner membrane portion id is adsorbed on the sealing element.
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