US 12,267,636 B2
Mems microphone
Siewseong Tan, Singapore (SG); Yangmeng Chang, Singapore (SG); Tiongkee Chua, Singapore (SG); Jingxin Pu, Shenzhen (CN); and Rui Zhang, Shenzhen (CN)
Assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed by AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed on Nov. 25, 2022, as Appl. No. 17/994,026.
Application 17/994,026 is a continuation of application No. PCT/CN2022/093437, filed on May 18, 2022.
Claims priority of application No. 202220933196.X (CN), filed on Apr. 21, 2022.
Prior Publication US 2023/0345157 A1, Oct. 26, 2023
Int. Cl. H04R 1/04 (2006.01); H04R 19/04 (2006.01)
CPC H04R 1/04 (2013.01) [H04R 19/04 (2013.01); H04R 2201/003 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A MEMS microphone, including:
a housing body with a containment space;
a sound hole penetrating the housing body;
a MEMS microphone chip includes at least a first MEMS microphone chip and a second MEMS microphone chip accommodated in the containment space;
an ASIC chip accommodated in the containment space; and
a subtractor;
wherein
the first MEMS microphone chip has a frequency response droop characteristic less than 1 khz;
the second MEMS microphone chip has a frequency response droop characteristic ranging from 1 khz to 30 khz;
an output signal of the first MEMS microphone chip and an output signal of the second MEMS microphone chip are both input to the subtractor for outputting an input signal to the ASIC chip; the subtractor is configured to eliminate ultrasonic frequency band signals of the output signals of the first MEMS microphone chip and the second MEMS microphone chip.