US 12,267,581 B2
Boot sequence in cold temperatures
Vincent Vacquerie, Longnes (FR); and Stéphane Belardi, Meudon (FR)
Assigned to GoPro, Inc., San Mateo, CA (US)
Filed by GoPro, Inc., San Mateo, CA (US)
Filed on Feb. 10, 2023, as Appl. No. 18/108,249.
Claims priority of provisional application 63/315,531, filed on Mar. 1, 2022.
Prior Publication US 2023/0283891 A1, Sep. 7, 2023
Int. Cl. H04N 23/65 (2023.01); G06F 1/3206 (2019.01); G06F 1/324 (2019.01); G06F 1/3296 (2019.01); H04N 23/52 (2023.01)
CPC H04N 23/651 (2023.01) [G06F 1/3206 (2013.01); G06F 1/324 (2013.01); G06F 1/3296 (2013.01); H04N 23/52 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a temperature sensor; and
a processing apparatus that is configured to:
access a temperature measurement from the temperature sensor;
responsive to the temperature measurement being below a threshold, set a clock frequency for a clock signal used by an integrated circuit to a first frequency, wherein the integrated circuit includes multiple power domains;
select a first non-empty subset of the power domains in the integrated circuit for activation based on one or more temperature measurements from the temperature sensor;
activate the first non-empty subset of the power domains for use during a boot sequence;
disable a second non-empty subset of the power domains, disjoint from the first non-empty subset, during the boot sequence; and
execute boot code in the integrated circuit using the clock signal at the first frequency, wherein the first frequency is lower than a second frequency that the integrated circuit is configured to use when executing the boot code at temperature measurements above the threshold.