US 12,267,061 B2
Surface acoustic wave device
Naoki Daimon, Nagaokakyo (JP); Taku Kikuchi, Nagaokakyo (JP); and Osamu Shimono, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Aug. 19, 2021, as Appl. No. 17/406,127.
Application 17/406,127 is a continuation of application No. PCT/JP2020/006228, filed on Feb. 18, 2020.
Claims priority of application No. 2019-034530 (JP), filed on Feb. 27, 2019.
Prior Publication US 2021/0384885 A1, Dec. 9, 2021
Int. Cl. H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01)
CPC H03H 9/02543 (2013.01) [H03H 9/058 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A surface acoustic wave device comprising:
a piezoelectric substrate including a first principal surface and a second principal surface opposed to each other;
an interdigital transducer (IDT) electrode on a first principal surface side of the first principal surface and the second principal surface; and
a first dielectric film between the piezoelectric substrate and the IDT electrode and in contact with the first principal surface; wherein
the first principal surface is a polarization positive potential surface of the piezoelectric substrate.