CPC H02K 11/215 (2016.01) [H02K 41/031 (2013.01); H04N 23/54 (2023.01)] | 20 Claims |
1. An electronic device comprising:
a housing; and
a camera module disposed within the housing, the camera module comprising:
an image sensor defining an active imaging area;
a lens group defining a focal plane aligned with the active imaging area of the image sensor, the lens group comprising a set of lens elements; and
an actuator assembly mechanically coupled to one of the image sensor or at least one lens element of the set of lens elements, the actuator assembly comprising a first coil segment and a second coil segment positioned over the first coil segment, the first coil segment comprising:
a dielectric substrate defining:
an upper surface; and
a lower surface;
a first trace following a first path comprising multiple turns, the first trace formed onto the upper surface of the dielectric substrate;
a second trace following a second path comprising multiple turns, the second trace formed onto the lower surface of the dielectric substrate, the second trace conductively coupled to the first trace;
an encapsulation material encapsulating the first trace and the second trace and at least a portion of the dielectric substrate; and
a set of contact pads extending through the encapsulation material, wherein a first pair of contact pads of the set of contact pads are conductively coupled to the first trace and the second trace and a second pair of contact pads of the set of contact pads are conductively coupled to a respective pair of contact pads of the second coil segment.
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