US 12,266,874 B2
Thermal connection between printed circuit board and base plate with epoxy molded material
Uwe Stephan, Schaumburg, IL (US); and Donald J. Zito, Fox River Grove, IL (US)
Assigned to Vitesco Technologies USA, LLC, Auburn Hills, MI (US)
Filed by Vitesco Technologies USA, LLC, Auburn Hills, MI (US)
Filed on May 2, 2022, as Appl. No. 17/661,645.
Prior Publication US 2023/0352861 A1, Nov. 2, 2023
Int. Cl. H01R 12/57 (2011.01); H01R 13/502 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01)
CPC H01R 12/57 (2013.01) [H01R 13/502 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 3/4626 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a control unit, including:
a base plate;
a printed circuit board (PCB) connected to the base plate;
an encapsulation housing, the encapsulation housing further comprising:
a first layer disposed on a side of the PCB; and
a second layer disposed on a side of the base plate;
at least one flow aperture integrally formed as part of the base plate;
a heat transfer layer formed as part of the encapsulation housing, the heat transfer layer disposed between the PCB and the base plate, such that the heat transfer layer transfers heat from the PCB to the base plate, and at least a portion of the encapsulation housing is disposed in the at least one flow aperture and is integrally formed with the heat transfer layer and the second layer, and is located between the heat transfer layer and the second layer;
wherein the base plate and the PCB are connected together by the encapsulation housing, and the heat transfer layer is disposed on the opposite side of the PCB relative to the first layer, and the heat transfer layer is disposed on the opposite side of the base plate relative to the second layer.